Patents/Inventors

Vipul Mehta

Chandler, AZUS7 patents

8 Patents

US123622502025
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US121304822024
Hydrophobic Feature to Control Adhesive Flow
Intel Corporation
0 cites
US120092712024
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US120027272024
Barrier Structures for Underfill Containment
Intel Corporation
0 cites
US117768212023
Micro-electronic Package with Substrate Protrusion to Facilitate Dispense of Underfill Between a Narrow Die-to-die Gap
Intel Corporation
0 cites
US117495852023
High Thermal Conductivity, High Modulus Structure Within a Mold Material Layer of an Integrated Circuit Package
Intel Corporation
0 cites
US116886342023
Trenches in Wafer Level Packages for Improvements in Warpage Reliability and Thermals
Intel Corporation
0 cites
US116768762023
Semiconductor Die Package with Warpage Management and Process for Forming Such
Intel Corporation
0 cites