5 Patents
- US125766332026Matching Electrically Conductive Line Resistances to Switches in Fluidic Dies
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
- US122336452025Fluidic Die Having Trickle-warming and Pulse-warming Circuits
Hewlett-packard Development Company, L.P.
0 cites - US118582692024Cavitation Plate to Protect a Heating Component and Detect a Condition
Hewlett-packard Development Company, L.P.
0 cites - 0 cites