15 Patents
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- US125737442026Wideband Antennas in Glass Through Direct via Feeding and Glass Stacking
Intel Corporation
0 cites - US124446192025Physical Vapor Deposition Seeding for High Aspect Ratio Vias in Glass Core Technology
Intel Corporation
0 cites - US124247162025RF Filters and Multiplexers Manufactured in the Core of a Package Substrate Using Glass Core Technology
Intel Corporation
0 cites - US124247192025Compact Surface Transmission Line Waveguides with Vertical Ground Planes
Intel Corporation
0 cites - US124009342025Dielectric Film Coating for Through Glass Vias and Plane Surface Roughness Mitigation
Intel Corporation
0 cites - US123680912025Package Substrate with Glass Core Having Vertical Power Planes for Improved Power Delivery
Intel Corporation
0 cites - US123477612025Magnetic Planar Spiral and High Aspect Ratio Inductors for Power Delivery in the Glass-core of a Package Substrate
Intel Corporation
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- US121530322024Interconnected Corrugated Carbon-based Network
The Regents Of The University Of California
0 cites - US117282582023Electroless Metal-defined Thin Pad First Level Interconnects for Lithographically Defined Vias
Intel Corporation
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- US115812382023Heat Spreading Layer Integrated Within a Composite IC Die Structure and Methods of Forming the Same
Intel Corporation
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