6 Patents
- US119423342024Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
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- US117496282023Sacrificial Redistribution Layer in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
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- US116212362023Electrostatic Discharge Protection in Integrated Circuits Using Positive Temperature Coefficient Material
Intel Corporation
0 cites