Patents/Inventors

Valery Ouvarov-bancalero

Scottsdale, AZUS1 patent

2 Patents

US122305642025
Package Substrate Z-disaggregation with Liquid Metal Interconnects
Intel Corporation
0 cites
US121836882024
Integrated Circuit Die Package Stiffeners of Metal Alloys Having Exceptionally High CTE
Intel Corporation
0 cites