Vahid Akhavan Attar

3 Patents

• US125596012026

  Method for Curing Thermosetting Polymers

  Pulse Forge, Inc.

  0 cites
• US125388302026

  Method and Apparatus for Debonding Temporarily Bonded Wafers in Wafer-level Packaging Applications

  PULSEFORGE, Inc.

  0 cites
• US119963842024

  Method and Apparatus for Debonding Temporarily Bonded Wafers in Wafer-level Packaging Applications

  Pulseforge, Inc.

  0 cites