4 Patents
- US123621912025Methods and Devices Related to Radio Frequency Devices
Infineon Technologies Dresden GmbH & Co. KG
0 cites - US121129922024Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component
Infineon Technologies AG
0 cites - US119488022024Methods and Devices Related to Radio Frequency Devices
Infineon Technologies Dresden GmbH & Co. KG
0 cites - US116055722023Electronic Component with Semiconductor Die Having a Low Ohmic Portion with an Active Area and a High Ohmic Portion on a Dielectric Layer
Infineon Technologies AG
0 cites