Patents/Inventors

Ute Steinhaeusser

MunichDE2 patents

3 Patents

US120741202024
Electric Component with Pad for a Bump and Manufacturing Method Thereof
RF360 Singapore Pte. Ltd.
0 cites
US119679382024
Corrosion Resistant Pad for Enhanced Thin Film Acoustic Packaging (TFAP)
RF360 SINGAPORE PTE. Ltd.
0 cites
US118948292024
Variation of Metal Layer Stack Under Under Bump Metallization (UBM)
RF360 Singapore Pte. Ltd.
0 cites