Patents/Inventors

Unbyoung Kang

Hwaseong-siKR16 patents

19 Patents

US124514742025
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US124447032025
Manufacturing Method of Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US124009902025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123946412025
Molding Apparatus of Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123550042025
Semiconductor Chip and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122180862025
Semiconductor Package and Method of Manufacturing Same
Samsung Electronics Co., Ltd.
0 cites
US122180962025
Semiconductor Package and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US122181022025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121990562025
Semiconductor Device, Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US121763132024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120274822024
Semiconductor Chip Having a Through Electrode and Semiconductor Package Including the Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US119675812024
Package Structures Having Underfills
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358322024
Semiconductor Device and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US117913082023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117053232023
Wafer Trimming Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116887072023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581412023
Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115879062023
Package Structures Having Underfills
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691452023
Semiconductor Package with Thermal Interface Material for Improving Package Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites