26 Patents
- US125124272025Semiconductor Device Including Lower Pads Having Different Widths and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US122118062025Semiconductor Package with Dummy Pattern Not Electrically Connected to Circuit Pattern
Samsung Electronics Co., Ltd.
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- US121130502024Semiconductor Package with Increased Thermal Radiation Efficiency
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120948472024Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120402942024Semiconductor Devices and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
0 cites - US120149772024Interconnection Structure, Method of Fabricating the Same, and Semiconductor Package Including Interconnection Structure
SAMSUNG ELECTRONICS CO., Ltd.
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- US119358732024Methods of Inspection of Semiconductor Packages Including Measurement of Alignment Accuracy Among Semiconductor Chips
Samsung Electronics Co., Ltd.
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- US116949782023Semiconductor Devices and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
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- US116886792023Interconnection Structure, Method of Fabricating the Same, and Semiconductor Package Including Interconnection Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
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- US116581312023Semiconductor Package with Dummy Pattern Not Electrically Connected to Circuit Pattern
SAMSUNG ELECTRONICS CO., Ltd.
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