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Inventors
Ulrich Tschinderle
Villach
AT
1 patent
2 Patents
US11942356
2024
Clipping Mechanism for Fastening a Substrate for a Surface Treatment of the Substrate
SEMSYSCO GmbH
0 cites
US11810796
2023
Wafer Cleaning Method and Apparatus Therefore
LAM RESEARCH AG
0 cites