Patents/Inventors

Tzyy-jang Tseng

Taoyuan CityTW24 patents

21 Patents

US125636672026
Manufacturing Method of Circuit Board Structure
Unimicron Technology Corp.
0 cites
US124128792025
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US124142432025
Manufacturing Method of Package Structure
Unimicron Technology Corp.
0 cites
US123099432025
Circuit Carrier and Manufacturing Method Thereof and Package Structure
Unimicron Technology Corp.
0 cites
US122438382025
Circuit Substrate Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US119918242024
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US119438772024
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US119233502024
Light Emitting Diode Package Structure
Unimicron Technology Corp.
0 cites
US118604282024
Package Structure and Optical Signal Transmitter
Unimicron Technology Corp.
0 cites
US118375912023
Manufacturing Method of Light Emitting Diode Package Structure
Unimicron Technology Corp.
0 cites
US118087872023
Probe Card Testing Device
Unimicron Technology Corp.
0 cites
US117643442023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US117157152023
Metal Bump Structure and Manufacturing Method Thereof and Driving Substrate
Unimicron Technology Corp.
0 cites
US117106902023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116901732023
Circuit Board Structure
Unimicron Technology Corp.
0 cites
US116901802023
Manufacturing Method of Carrier Structure
Unimicron Technology Corp.
0 cites
US116826122023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116658322023
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116009362023
Circuit Board Structure
Unimicron Technology Corp.
0 cites
US115791782023
Inspection Apparatus for Bare Circuit Board
Unimicron Technology Corp.
0 cites
US115629722023
Manufacturing Method of the Chip Package Structure Having at Least One Chip and at Least One Thermally Conductive Element
Unimicron Technology Corp.
0 cites