Tzung-hui Lee

4 Patents

• US120948302024

  Integrated Fan-out (info) Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118550142023

  Semiconductor Device and Method

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118482332023

  Semiconductor Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118429552023

  Method of Making an Integrated Circuit Package Including an Integrated Circuit Die Soldered to a Bond Pad of a Redistribution Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites