Patents/Inventors

Tzuan-horng Liu

Taoyuan CityTW57 patents

57 Patents

US126108342026
Semiconductor Device Package Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
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US125754652026
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125663022026
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US125688272026
Method for Fabricating Device Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125641082026
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US125388142026
Semiconductor Structure with a Bridge Embedded Therein and Method Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US125060992025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124890772025
Semiconductor Structure and Method Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124697532025
Integrated Circuit Component and Package Structure Having the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124631332025
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124514172025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124180052025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
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US124069652025
Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123623292025
Method of Fabricating Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123621782025
Method for Fabricating a Chip Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123550082025
Methods of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123005632025
Semiconductor Package and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122887522025
Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122726742025
Stacking Structure, Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US122666392025
Method of Fabricating Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122242652025
Three-dimensional Stacking Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121990242025
Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121548752024
Package and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121548972024
Package Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
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US121486642024
Semiconductor Device and Method Having a Through Substrate via and an Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
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US121320242024
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US121258212024
Package Having Multiple Chips Integrated Therein and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121193282024
Methods of Fabricating the Same Die Stack Structure and Semiconductor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
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US120948522024
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
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US120741362024
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120574372024
Package Structure, Chip Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120574382024
Die Stack Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120574392024
Integrated Circuit Packages
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120516732024
Package Having Multiple Chips Integrated Therein and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120465792024
Package Having Bonding Layers
Taiwan Semiconductor Manufacturing Company, Ltd.
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US120274942024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120150132024
Die Stack Structure, Semiconductor Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119358712024
Semiconductor Package and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119160122024
Manufacturing Method of Semiconductor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119160252024
Device Die and Method for Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119086922024
Method for Fabricating a Chip Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118943092024
System on Integrated Chips (soic) and Semiconductor Structures with Integrated Soic
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118698192024
Integrated Circuit Component and Package Structure Having the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118549212023
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118239802023
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118108972023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117841632023
Stacking Structure, Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117422972023
Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116825932023
Interposer Test Structures and Methods
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116643152023
Structure with Interconnection Die and Method of Making Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116580692023
Method for Manufacturing a Semiconductor Device Having an Interconnect Structure Over a Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US115944602023
Semiconductor Package and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115878942023
Package and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115879072023
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115748782023
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US115629832023
Package Having Multiple Chips Integrated Therein and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115520742023
Package Structures and Methods of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites