17 Patents
- 0 cites
- US125989712026Conductive via with Improved Gap Filling Performance
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125575662026Semiconductor Device Having a Switching Layer Including a Compound Having Aluminum, Oxygen, and Nitrogen and Method for Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US124842322025Ferroelectric Memory Device and Method of Fabricating the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124245792025Integrated Chip Including an Upper Conductive Structure Having Multilayer Stack to Decrease Fabrication Costs and Increase Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123693292025Bottom-electrode Interface Structure for Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123546332025Spacer Film Scheme Form Polarization Improvement
Taiwan Semiconductor Manfacturing Company, Ltd.
0 cites - US121609952024Wakeup Free Approach to Improve the Ferroelectricity of Feram Using a Stressor Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121375722024Ferroelectric Memory Device and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121190352024Spacer Film Scheme for Polarization Improvement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119730502024Method for Forming an Upper Conductive Structure Having Multilayer Stack to Decrease Fabrication Costs and Increase Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119394312024Temperature Sensitive Composition for Tissue Adhesion Prevention and Application Thereof
PROVIEW-MBD BIOTECH CO., Ltd.
0 cites - US119394322024Amino Acid-modified Polymer for Adhesion Prevention and Application Thereof
PROVIEW-MBD BIOTECH CO., Ltd.
0 cites - US117929962023Bottom-electrode Interface Structure for Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117372802023Wakeup Free Approach to Improve the Ferroelectricity of Feram Using a Stressor Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116467682023Method and Apparatus for Downlink Transmission in a Cloud Radio Access Network
HON LIN TECHNOLOGY CO., Ltd.
0 cites