Tz-jun Kuo

3 Patents

• US123082822025

  Interconnect Structure Without Barrier Layer on Bottom Surface of Via

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US117156892023

  Method of Forming Metal Interconnection

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US115519672023

  Via Structure and Methods for Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites