Patents/Inventors

Tyler Leuten

Orangeville, CAUS7 patents

6 Patents

US122373002025
Through-substrate Void Filling for an Integrated Circuit Assembly
Intel Corporation
0 cites
US120965662024
Reciprocal PCB Manufacturing Process
Intel Corporation
0 cites
US119489172024
Die Over Mold Stacked Semiconductor Package
Intel Corporation
0 cites
US118111822023
Solderless BGA Interconnect
Intel Corporation
0 cites
US116462532023
Ball Interconnect Structures for Surface Mount Components
Intel Corporation
0 cites
US115629782023
Decoupling Capacitor Mounted on an Integrated Circuit Die, and Method of Manufacturing the Same
Intel Corporation
0 cites