Tung Yao Lin

5 Patents

• US125002052025

  Method for Manufacturing Semiconductor Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US122180942025

  Electronic Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US119358552024

  Electronic Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118174212023

  Method for Manufacturing Semiconductor Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116520812023

  Method for Manufacturing Semiconductor Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites