Patents/Inventors

Tung-sheng Hsiao

New TaipeiTW1 patent

2 Patents

US118442862023
Flat Bottom Electrode via (BEVA) Top Surface for Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117514852023
Flat Bottom Electrode via (BEVA) Top Surface for Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites