Tung-i Lin

3 Patents

• US125074332025

  Semiconductor Device and Method of Manufacturing the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US124566612025

  Semiconductor Structure Having a Silicon Active Layer Formed Over a Sige Etch Stop Layer and an Insulating Layer with a Through Silicon via (TSV) Passed Therethrough

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US116108082023

  Semiconductor Wafer with Low Defect Count and Method for Manufacturing Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites