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Inventors
Tung-hsing Lee
Hsinchu
TW
1 patent
2 Patents
US12480987
2025
Dynamic Voltage Stress Condition Optimization Method and Dynamic Voltage Stress Condition Optimization System Capable of Performing Block-based Dynamic Voltage Stress Wafer Testing Process
MEDIATEK Inc.
0 cites
US11610839
2023
Dummy Fill Structures
GLOBALFOUNDRIES U.S. Inc.
0 cites