Patents/Inventors

Tsuyoshi Hayasaka

TokyoJP1 patent

2 Patents

US120845992024
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
RESONAC CORPORATION
0 cites
US118406482023
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
RESONAC CORPORATION
0 cites