Patents/Inventors

Tsukasa Ichikawa

SagaJP1 patent

2 Patents

US122372932025
Palladium-coated Copper Bonding Wire, Manufacturing Method of Palladium-coated Copper Bonding Wire, Wire Bonding Structure Using the Same, Semiconductor Device and Manufacturing Method Thereof
TANAKA DENSHI KOGYO K. K.
0 cites
US118760662024
Palladium-coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, and Manufacturing Method of Semiconductor Device
TANAKA DENSHI KOGYO K.K.
0 cites