Tsang-yu Liu

7 Patents

• US124731972025

  Chip Package

  XINTEC Inc.

  0 cites
• US122727122025

  Chip Package and Method for Forming a Chip Package Having First and Second Stack of Dummy Metal Layers Surround the Sensing Region

  Xintec Inc.

  0 cites
• US122373542025

  Chip Package and Method for Forming the Same

  Xintec Inc.

  0 cites
• US119425632024

  Manufacturing Method of Chip Package and Chip Package

  XINTEC Inc.

  0 cites
• US118732122024

  Chip Package and Manufacturing Method Thereof

  Xintec Inc.

  0 cites
• US117460032023

  Chip Package

  XINTEC Inc.

  0 cites
• US117053682023

  Manufacturing Method of Chip Package and Chip Package

  XINTEC Inc.

  0 cites