Patents/Inventors

Tsang-jiuh Wu

HsinchuTW19 patents

21 Patents

US123746512025
Wafer Bonding Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123226802025
Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122768382025
Semiconductor Device and Manufacturing Method Thereof Having Grating Coupled Dies and Nanostructures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122782032025
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122495662025
3DIC with Gap-fill Structures and the Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122372842025
Semiconductor Structure Comprising Dummy Feature Interposed Between the Bonding Connectors
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121598602024
Singulation and Bonding Methods and Structures Formed Thereby
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121424852024
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121425242024
Via for Component Electrode Connection
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120740642024
TSV Structure and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120150082024
Wafer Bonding Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119730552024
Wafer Bonding Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119618002024
Via for Semiconductor Device Connection and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119489202024
Semiconductor Device and Method for Manufacturing the Same, and Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118550212023
Semiconductor Structure with Through Substrate Vias and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118239792023
Method of Forming Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117746752023
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117568832023
Through via Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117282962023
Interconnect Structure and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115944202023
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115453922023
Semiconductor Component Having Through-silicon Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites