12 Patents
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- US121837082024Double Resist Structure for Electrodeposition Bonding
International Business Machines Corporation
0 cites - US121660082024Injection Molded Solder Head with Improved Sealing Performance
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US121426032024Bonding of Bridge to Multiple Semiconductor Chips
International Business Machines Corporation
0 cites - US120948252024Interconnection Between Chips by Bridge Chip
International Business Machines Corporation
0 cites - US119698282024Prevention of Dripping of Material for Material Injection
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US118482722023Interconnection Between Chips by Bridge Chip
International Business Machines Corporation
0 cites - US117355752023Bonding of Bridge to Multiple Semiconductor Chips
International Business Machines Corporation
0 cites - US116849882023Prevention of Dripping of Material for Material Injection
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites