Patents/Inventors

Toyo Ohashi

SaitamaJP6 patents

6 Patents

US125636662026
Metal Sheet Material, Layered Body, Insulated Circuit Board, and Metal Sheet Material Manufacturing Method
MITSUBISHI MATERIALS CORPORATION
0 cites
US121779622024
Insulating Resin Circuit Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites
US121375262024
Bonded Body and Insulating Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites
US121333382024
Insulated Circuit Substrate Manufacturing Method
MITSUBISHI MATERIALS CORPORATION
0 cites
US121085282024
Insulating Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites
US120682192024
Heat Sink Integrated Insulating Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites