Toshiyuki Sugimoto

2 Patents

• US122857672025

  Solder Particle Classifying Method, Solder Particle, Solder Particle Classifying System, Adhesive Composition, and Adhesive Film

  Resonac Corporation

  0 cites
• US119356692024

  Method for Dispersing Conductive Particles, and Electrostatic Adsorption Device

  0 cites