Patents/Inventors

Toshio Shiobara

TokyoJP10 patents

10 Patents

US125402222026
Fluoroplastic Substrate for High-speed Communications and Copper-clad Fluoroplastic Substrate for High-speed Communications
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US124777092025
Electromagnetic Wave Shielding Sheet
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US124418922025
Low Dielectric Silica Powder, Resin Composition Containing the Silica Powder, and Method for Manufacturing Low Dielectric Silica Powder
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US121163042024
Method for Packing Quartz Glass Cloth
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US120982902024
Low Dielectric Silica Powder, Resin Composition Containing the Silica Powder, and Method for Manufacturing Low Dielectric Silica Powder
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US120354612024
Low Dielectric Substrate for High-speed Millimeter-wave Communication
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US119743892024
Low Dielectric Substrate for High-speed Millimeter-wave Communication
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US119200112024
Resin Substrate Having Dielectric Characteristics with Little Frequency Dependence
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US118021922023
Low Dielectric Resin Substrate
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US116784322023
Low Dielectric Substrate for High-speed Millimeter-wave Communication
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites