30 Patents
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- US122834302025Ceramic Electronic Device Having a Copper-containing Baked Electrode Layer
TDK CORPORATION
0 cites - US122304482025Electronic Component with Metal Terminal, Connection Structure, and Method for Manufacturing Connection Structure
TDK CORPORATION
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- US119616752024Ceramic Electronic Device Having an Element Body with a Boundary Layer Including Ba and Ti at an End of a Ceramic Layer
TDK CORPORATION
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- US118428552023Multilayer Electronic Component with Alternating Dielectric and Internal Electrode Layers
TDK CORPORATION
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