Toshihiro Hosoi

7 Patents

• US123516982025

  Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites
• US122973542025

  Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites
• US121761502024

  Double-sided Copper-clad Laminate

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites
• US121395922024

  Resin Composition Comprising Coated Metal Oxide Particles, Resin-attached Metal Foil, Metal-clad Laminated Sheet, and Capacitor Element

  Mitsui Mining & Smelting Co., Ltd.

  0 cites
• US119503762024

  Copper-clad Laminate

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites
• US118908532024

  Resin Layered Product, Dielectric Layer, Metal Foil with Resin, Capacitor Element, and Printed Wiring Board with Built-in Capacitor

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites
• US116704552023

  Double-sided Copper-clad Laminate

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites