5 Patents
- US126108392026Packaged Microelectronic Devices Having Stacked Interconnect Elements and Methods for Manufacturing the Same
Micron Technology, Inc.
0 cites - US123477312025Semiconductor Components Having Conductive Vias with Aligned Back Side Conductors
Micron Technology, Inc.
0 cites - US118698092024Semiconductor Components Having Conductive Vias with Aligned Back Side Conductors
Micron Technology, Inc.
0 cites - US115945252023Packaged Integrated Circuit Devices with Through-body Conductive Vias, and Methods of Making Same
Micron Technology, Inc.
0 cites