Patents/Inventors

Tomoyuki Ikeda

OgakiJP4 patents

5 Patents

US122132482025
Printed Wiring Board
IBIDEN CO., Ltd.
0 cites
US121891932025
Semiconductor Package
IBIDEN CO., Ltd.
0 cites
US121931562025
Wiring Substrate and Method for Manufacturing Wiring Substrate
IBIDEN CO., Ltd.
0 cites
US121693122024
Semiconductor Package
IBIDEN CO., Ltd.
0 cites
US117156982023
Wiring Substrate
IBIDEN CO., Ltd.
0 cites