Tomoya Oohiraki

3 Patents

• US119087682024

  Method of Manufacturing Bonded Body for Insulation Circuit Substrate Board and Bonded Body for Insulation Circuit Substrate Board

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US117354342023

  Method for Producing Insulating Circuit Substrate with Heat Sink

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US116768822023

  Method of Manufacturing Power Module Substrate Board and Ceramic-copper Bonded Body

  MITSUBISHI MATERIALS CORPORATION

  0 cites