Patents/Inventors

Tomoya Daizo

OgakiJP3 patents

3 Patents

US120339272024
Method for Manufacturing Wiring Substrate
IBIDEN CO., Ltd.
0 cites
US119358222024
Wiring Substrate Having Metal Post Offset from Conductor Pad and Method for Manufacturing Wiring Substrate
IBIDEN CO., Ltd.
0 cites
US116224462023
Wiring Substrate
IBIDEN CO., Ltd.
0 cites