Tomohiro Nagoya

5 Patents

• US124513672025

  Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame with Temporary Protective Film, Encapsulation Molded Body with Temporary Protective Film, and Method for Manufacturing Semiconductor Device

  0 cites
• US124352482025

  Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulation Molded Body, and Method for Manufacturing Semiconductor Package

  0 cites
• US123982982025

  Temporary Protective Film for Producing Semiconductor Device, Reel Body, and Method for Producing Semiconductor Device

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• US119087622024

  Temporary Protective Film for Semiconductor Sealing Molding, Lead Frame with Temporary Protective Film, Sealed Molded Body with Temporary Protective Film, and Method for Producing Semiconductor Device

  RESONAC CORPORATION

  0 cites
• US116825642023

  Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulated Molded Body Provided with Temporary Protective Film, and Method for Manufacturing Semiconductor Device

  RESONAC CORPORATION

  0 cites