Patents/Inventors

Tomoaki Machida

NaganoJP1 patent

2 Patents

US116120632023
Method of Making Interconnect Substrate and Insulating Sheet
SHINKO ELECTRIC INDUSTRIES CO., Ltd.
0 cites
US115944782023
Wiring Substrate, Semiconductor Package and Method of Manufacturing Wiring Substrate
SHINKO ELECTRIC INDUSTRIES CO., Ltd.
0 cites