8 Patents
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- US120149642024Semiconductor Package Having an Electrically Insulating Core with Exposed Glass Fibres
Infineon Technologies Americas Corp.
0 cites - US119790962024Multiphase Inverter Apparatus Having Half-bridge Circuits and a Phase Output Lead for Each Half-bridge Circuit
Infineon Technologies Austria AG
0 cites - US119730632024Semiconductor Package with Low Parasitic Connection to Passive Device
Infineon Technologies AG
0 cites - US119159992024Semiconductor Device Having a Carrier, Semiconductor Chip Packages Mounted on the Carrier and a Cooling Element
Infineon Technologies AG
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- US116462522023Semiconductor Device Including an Extension Element for Air Cooling
Infineon Technologies AG
0 cites - US116005582023Plurality of Transistor Packages with Exposed Source and Drain Contacts Mounted on a Carrier
Infineon Technologies AG
0 cites