Patents/Inventors

Tom Ho Wing Yu

Campbell, CAUS3 patents

4 Patents

US120947732024
Methods for Low Resistivity and Stress Tungsten Gap Fill
APPLIED MATERIALS, Inc.
0 cites
US117988452023
Methods and Apparatus for Low Resistivity and Stress Tungsten Gap Fill
APPLIED MATERIALS, Inc.
0 cites
US116371072023
Silicon-containing Layer for Bit Line Resistance Reduction
APPLIED MATERIALS, Inc.
0 cites
US116264102023
Silicon-containing Layer for Bit Line Resistance Reduction
APPLIED MATERIALS, Inc.
0 cites