Patents/Inventors

Ting-ting Kuo

HsinchuTW15 patents

15 Patents

US125577072026
Method of Fabricating Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124758602025
Display and Backlight Compensation Method Thereof
AUO Display Plus Corporation
0 cites
US124761782025
Reduction of Cracks in Redistribution Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124698072025
Fan-out Package Structures with Cascaded Openings in Enhancement Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124314462025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US123227162025
Heat Dissipating Features for Laser Drilling Process
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122058602025
Sensor Packages
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120682122024
Package Structure with Through via Extending Through Redistribution Layer and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120150172024
Package Structure, Package-on-package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120093222024
Package Structure with Through-via in Molding Compound and Dielectric Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118478522023
Manufacturing Method of Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118429932023
Semiconductor Device with Multiple Polarity Groups
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117422542023
Sensor Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116316582023
Under-bump-metallization Structure and Redistribution Layer Design for Integrated Fan-out Package with Integrated Passive Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115807672023
Fingerprint Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites