Ting-ting Chen

12 Patents

• US124127792025

  Bilayer Seal Material for Air Gaps in Semiconductor Devices

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US123693882025

  Semiconductor Devices with Tunable Low-k Inner Air Spacers

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US123362142025

  Inner Spacers for Gate-all-around Semiconductor Devices

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US123242002025

  Seal Material for Air Gaps in Semiconductor Devices

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120949522024

  Air Spacer Formation with a Spin-on Dielectric Material

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119159362024

  Semiconductor Structure and Manufacturing Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US119012202024

  Bilayer Seal Material for Air Gaps in Semiconductor Devices

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US118552142023

  Inner Spacers for Gate-all-around Semiconductor Devices

  TAIWAN SEMICONDUCTOR MANUFACTURING Co. Ltd.

  0 cites
• US118482382023

  Methods for Manufacturing Semiconductor Devices with Tunable Low-k Inner Air Spacers

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US116887662023

  Seal Material for Air Gaps in Semiconductor Devices

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US116264822023

  Air Spacer Formation with a Spin-on Dielectric Material

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US115574832023

  Semiconductor Structure and Manufacturing Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites