Patents/Inventors

Ting-chen Tseng

HsinchuTW6 patents

7 Patents

US124761392025
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124128562025
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123226882025
Package Structure Including Auxiliary Dielectric Portion
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120947652024
Integrated Circuit Package and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120092262024
Semiconductor Device and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118625942024
Package Structure with Solder Resist Underlayer for Warpage Control and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118549272023
Semiconductor Package and Method of Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites