Tianwei Sun

2 Patents

• US117985452023

  Speech Interaction Method and Apparatus, Device and Storage Medium

  Beijing Xiaomi Pinecone Electronics Co., Ltd.

  0 cites
• US116160402023

  Semiconductor Dies Having Ultra-thin Wafer Backmetal Systems, Microelectronic Devices Containing the Same, and Associated Fabrication Methods

  NXP USA, Inc.

  0 cites