Tianjian Liu

8 Patents

• US126159992026

  Chip Bonding Method

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US126106322026

  Semiconductor Device and Manufacturing Method Therefor, and Chip Bonding Structure

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US125387702026

  Interconnection Layer Filled in Through-silicon via (TSV) Semiconductor Device and Manufacturing Method Therefor

  WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US124631652025

  Bonding Structure and Manufacturing Method Therefor

  Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

  0 cites
• US124313642025

  Method for Manufacturing Packaging Enclosure and Method for Manufacturing Packaging Chip

  Hubei Yangtze Pilot-line Services Co., Ltd.

  0 cites
• US124210802025

  Method and Apparatus for Non-contact and Eye-movement Input of Elevator Floor

  0 cites
• US121785772024

  Method and Apparatus for Fatigue Prediction Based on Analogue Brain Wave Data

  MINJIANG UNIVERSITY

  0 cites
• US121239962024

  Method for Experimentally Determining Critical Sand-carrying Gas Velocity of Shale Gas Wells

  0 cites