6 Patents
- US124944052025Fabricating a Sensing Component Encapsulated by an Encapsulation Layer with Roughed Surface Having a Hollow Region
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121712002024Carbon Sink Enhancement Method Based on Oyster-undaria Pinnatifida Integrated Aquaculture
National Marine Environmental Monitoring Center
0 cites - US120876542024Sensing Die Encapsulated by an Encapsulant with a Roughness Surface Having a Hollow Region
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117641242023Sensing Component Encapsulated by an Encapsulant with a Roughness Surface Having a Hollow Region
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites