18 Patents
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- US124314502025Device Including Semiconductor Chips and Method for Producing Such Device
Infineon Technologies AG
0 cites - US123946972025Method for Fabricating a Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw
Infineon Technologies Austria AG
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- US122180982025Chip Assembling on Adhesion Layer or Dielectric Layer, Extending Beyond Chip, on Substrate
Infineon Technologies AG
0 cites - US122118242025Power Semiconductor Package Having First and Second Lead Frames
Infineon Technologies AG
0 cites - US121548862024Semiconductor Packages Including Electrical Redistribution Layers of Different Thicknesses and Methods for Manufacturing Thereof
Infineon Technologies AG
0 cites - US120274812024Device Including Semiconductor Chips and Method for Producing Such Device
Infineon Technologies AG
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- US119554152024Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw
Infineon Technologies Austria AG
0 cites - US119159992024Semiconductor Device Having a Carrier, Semiconductor Chip Packages Mounted on the Carrier and a Cooling Element
Infineon Technologies AG
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- US116005582023Plurality of Transistor Packages with Exposed Source and Drain Contacts Mounted on a Carrier
Infineon Technologies AG
0 cites - US115691862023Device Including Semiconductor Chips and Method for Producing Such Device
Infineon Technologies AG
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