Thomas Stoek

7 Patents

• US120465402024

  Leadframe Package with Adjustable Clip

  Infineon Technologies AG

  0 cites
• US119012572024

  Semiconductor Package, Metal Sheet for Use in a Semiconductor Package, and Method for Producing a Semiconductor Package

  Infineon Technologies AG

  0 cites
• US118625412024

  Molded Semiconductor Package Having a Negative Standoff

  Infineon Technologies AG

  0 cites
• US117697482023

  Semiconductor Device Having a Metal Clip with a Solder Volume Balancing Reservoir

  Infineon Technologies AG

  0 cites
• US116996402023

  Power Semiconductor Module for PCB Embedding, Power Electronic Assembly Having a Power Module Embedded in a PCB, and Corresponding Methods of Production

  Infineon Technologies AG

  0 cites
• US116212042023

  Molded Semiconductor Module Having a Mold Step for Increasing Creepage Distance

  Infineon Technologies AG

  0 cites
• US115454592023

  Metal Clip with Solder Volume Balancing Reservoir

  Infineon Technologies AG

  0 cites