4 Patents
- US125123862025Semiconductor Component Arrangement, Method for Fabrication Thereof and Heat Dissipation Device
SCHAEFFLER TECHNOLOGIESAG& Co. KG
0 cites - US120465312024Semiconductor Component Arrangement, Method for Fabrication Thereof and Heat Dissipation Device
Vitesco Technologies GmbH
0 cites - US120468632024Apparatus and Method for Establishing an Electrically Conductive Connection Between Two Substrates
Vitesco Technologies, GmbH
0 cites - 0 cites