Thomas Hua-min Williams

6 Patents

• US125871782026

  High Speed, Low Power Hybrid Deserializer for Chiplet-to-chiplet Communication

  QUALCOMM INCORPORATED

  0 cites
• US125817132026

  Via Alternate Net Spacing

  QUALCOMM INCORPORATED

  0 cites
• US123549522025

  Integrated Circuits (ics) Employing Multi-pattern Metallization to Optimize Metal Interconnect Spacing for Improved Performance and Related Fabrication Methods

  QUALCOMM Incorporated

  0 cites
• US121130172024

  Packed Terminal Transistors

  QUALCOMM INCORPORATED

  0 cites
• US120092952024

  Comb / Fishbone Metal Stack

  QUALCOMM INCORPORATED

  0 cites
• US115629942023

  Dummy Cell and Tap Cell Layout Structure

  QUALCOMM INCORPORATED

  0 cites