7 Patents
- 0 cites
- US124613122025Cladding Structure in the Back End of Line of Photonics Chips
Globalfoundries U.S. Inc.
0 cites - 0 cites
- US121304702024PIC Die and Package with Multiple Level and Multiple Depth Connections of Fibers to On-chip Optical Components
Globalfoundries U.S. Inc.
0 cites - 0 cites
- US118289832023Photonics Chips Including Cavities with Non-right-angle Internal Corners
Globalfoundries U.S. Inc.
0 cites - US116503812023PIC Die and Package with Cover for Multiple Level and Multiple Depth Connections of Fibers to On-chip Optical Components
Globalfoundries U.S. Inc.
0 cites